High-load even pressure heatsink loading for low-profile blade computer applications
US7474530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.