Cooling device capable of reducing thickness of electronic apparatus
US7474533B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board unit with a cooling device includes a printed circuit board; a ventilation fan including blades rotating around a rotation axis intersecting the printed circuit board; a housing wall standing from a surface of the printed circuit board at a periphery of the ventilation fan; an inlet defined in the printed circuit board inside the housing wall and located under the blades of the ventilation fan; and an outlet defined in the housing wall to open in parallel with the surface of the printed circuit board. An electronic apparatus is also provided which further includes an electronic component mounted on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.