Methods and apparatuses for thermal dissipation
US7474534B2 · kind B2 · utility
0Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Oct 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.