Circuit board with multiple layer interconnect and method of manufacture
US7474537B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2005 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Aug 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is coupled to the substrate. The second electrical component is spaced from the first electrical component and is coupled to the substrate. The interconnect is formed on the substantially planar surface of the substrate and extends between the first electrical component and the second electrical component. The interconnect is formed by at least two layers of a conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.