Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array
US7474815B2 · kind B2 · utility
4Cited by
5References
1Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 14, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jan 26, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.