Stress isolated pressure sensing die
US7475597B2 · kind B2 · utility
16Cited by
8References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2007 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Feb 27, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/146
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a pressure sensing die to be mounted on a base, comprising: The invention further relates to a method of manufacturing such a sensing die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.