Patent · US Active

Orientation insensitive multi chamber thermosiphon

US7475718B2 · kind B2 · utility

17Cited by

9References

8Claims

0Family size

Assignee

Delphi Technologies · US

Inventors

Ilya Reyzin · Williamsville, US
Mohinder Singh Bhatti · Amherst, US
Shrikant Mukund Joshi · Williamsville, US

Key dates

Filing date	Nov 15, 2006
Grant date	Jan 13, 2009
Priority date	—
Expiry date	Jan 24, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to remove heat from an electronic device regardless of the orientation of the heat exchanger assembly. A plurality of side fins are disposed on the outer wall of the housing, and a plurality of top fins extend radially from a central axis (A) and are disposed on top of the housing. A wicking material is disposed on the interior of each chamber. A fan assembly is disposed on top of the top fins to blow air radially down into the fins.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.