Separable ball and socket assembly for electronic device mounts
US7475858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2007 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Oct 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/32737
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention provide a mounting assembly for mounting an electronic device to a surface. The mounting assembly generally includes a base including a mounting ball and a socket assembly operable to frictionally engage the ball to removably couple the socket assembly to the base. The base may be removably coupled with the surface and the socket assembly may be removably coupled with the electronic device. Such a configuration enables the electronic device to be easily positioned in confined environments by first attaching the base to the surface, then attaching the socket assembly to the base and positioning the socket assembly in a desired orientation, and finally attaching the electronic device to the socket assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.