Low-temperature curable photosensitive compositions
US7476489B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 10, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jun 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/127
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.