Method of patterning a surface using a deformable stamp
US7476523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2001 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Aug 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S530/815
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A deformable stamp for patterning a surface. The stamp can be placed in contact with an entire 3-dimensional object, such as a rod, in a single step. The stamp can also be used to pattern the inside of a tube or rolled over a surface to form a continuous pattern. The stamp may also be used for fluidic patterning by flowing material through channels defined by raised and recessed portions in the surface of the stamp as it contacts the substrate. The stamp may be used to deposit self-assembled monolayers, biological materials, metals, polymers, ceramics, or a variety of other materials. The patterned substrates may be used in a variety of engineering and medical applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.