Current sensor
US7476816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Apr 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.