Active matrix substrate and method of manufacturing the same
US7476899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | May 12, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13456
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Extraction wirings are respectively connected to a signal line of a switching element and a scanning line thereof, and led out to one side portion of a transparent insulating substrate. Conductive terminals respectively united with the extraction wiring are formed in tip end portions thereof, and a plurality of contact holes connected to the conductive terminals are formed on the conductive terminals so that a diver IC is mounted thereon by using conductive resin. Each of the extraction wirings is provided with a semiconductor film pattern in the vicinity of the contact hole for blocking the moisture in the conductive resin to reach the extraction wirings through an interlayer insulating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.