Low compressive TiNx materials and methods of making the same
US7476949B2 · kind B2 · utility
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100Claims
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Key dates
| Filing date | Jul 15, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Aug 8, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.