Fabricated adhesive microstructures for making an electrical connection
US7476982B2 · kind B2 · utility
4Cited by
26References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Feb 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.