Heat-dissipating member and thermal head attached to heat-dissipating member
US7477277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Dec 12, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/375
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heat-dissipating member includes a heat-dissipating section which is plate-shaped and which is attachable to a heat source directly or indirectly and also includes a plurality of heat-dissipating projections extending from the heat-dissipating section. The heat-dissipating projections are formed by louvering the heat-dissipating section so as to have predetermined heights. The heat-dissipating projections are arranged in increasing order of height in the direction from one end of the heat-dissipating section to an end of the heat-dissipating section that is opposed to the one end. A thermal head includes a plurality of heating elements arranged thereon and a head mount attached to the above heat-dissipating member directly or indirectly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.