Isolating stress on a printed circuit board
US7477521B2 · kind B2 · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2008 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Apr 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the PCB surrounding the edge connector to bend relative to the remainder of the PCB, thereby confine the bending to a localized area between the ends of the slots, and isolate the electrical components from any stresses caused thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.