Semiconductor device and method of manufacturing semiconductor device
US7477523B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jul 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0594
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist film formed on the first surface to cover the wires, and openings formed by partially opening the solder resist film, wherein a plurality of the elongated wires are arranged in parallel on the bottom of the openings, a semiconductor chip having electrodes flip chip connected to the wires are arranged on the bottom of the openings of the wiring board through a conductive bonding material, and an insulating resin is provided for filling an interstice between the wiring board and the semiconductor chip, wherein the wires extend along a width direction orthogonal to a longitudinal direction of the openings, the openings comprise elongated grooves which extend along at least two opposing sides of the square of the wiring board, a pair of opposing edges of the opening along the longitudinal direction define zig-zag edges in which the widths of the opening seem to be longer and shorter in a repeating sequence, and recessed edge portions which recess toward the outside of the opening formed by th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.