Apparatus for attaching a cooling structure to an integrated circuit
US7477527B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jul 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for attaching a cooling structure to the surface of an integrated circuit (IC). The attachment of the cooling structure, for example a heat sink, to the IC requires that certain pressure is applied, usually by connecting the cooling structure to a Printed Circuit Board (PCB). However, excess pressure may damage the ball grid array (BGA) that connects the IC to the PCB. Attachment of a cooling structure to the IC package substrate is provided without support from the PCB. In one embodiment, shock absorbers are also attached to the cooling structure and the PCB to prevent undesirable vibration of the heat sink mass from affecting the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.