Lamination of dry film to micro-fluid ejection head substrates
US7479203B2 · kind B2 · utility
3Cited by
4References
19Claims
0Family size
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Key dates
| Filing date | Aug 22, 2005 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | Aug 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.