Process for applying a material to a member
US7479245B2 · kind B2 · utility
2Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2004 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | Sep 26, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7096
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a process for applying a material to a member having an adhesion surface. Typically, the process includes applying the material to a mold, the member or both. Thereafter, the material is at least partially conformed to the shape of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.