Patent · US Active

Process for applying a material to a member

US7479245B2 · kind B2 · utility

2Cited by
26References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 27, 2004
Grant dateJan 20, 2009
Priority date
Expiry dateSep 26, 2026

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/7096
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

There is disclosed a process for applying a material to a member having an adhesion surface. Typically, the process includes applying the material to a mold, the member or both. Thereafter, the material is at least partially conformed to the shape of the mold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.