Arrangement of conductive connectors in a power semiconductor device
US7479693B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 8, 2005 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | Sep 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One of the aspects of the present invention is to provide a power semiconductor device, including a first substrate having a first circuit pattern formed thereon, and a second substrate having a second circuit pattern formed thereon. The first substrate has a first center line extending along a predetermined transverse direction. At least one power semiconductor chip is mounted on the first circuit pattern of the first substrate, and has at least one chip electrode opposing to the second circuit pattern of the second substrate. Also, a plurality of first conductive connectors on the first circuit pattern is provided for electrical connection with the second circuit pattern of the second substrate. The first conductive connectors are arranged symmetrically in relative to the first center line of the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.