Transmission line to waveguide interconnect and method of forming same including a heat spreader
US7479841B2 · kind B2 · utility
196Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2005 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | Jul 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.