Semiconductor sensor with projection for preventing proof mass from sticking to cover plate
US7481113B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Jul 18, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0842
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A disclosed semiconductor sensor includes a proof-mass, a frame disposed around the proof-mass and including at least a silicon layer, a beam for supporting the proof-mass, the beam being disposed at a first surface side of the frame between the proof-mass and the frame, a piezoresistor disposed on the beam, a metal wiring pattern and a pad electrode formed on the first surface of the frame and electrically connected to the piezoresistor, a cover plate disposed above and spaced apart from the proof-mass and the beam at the first surface side of the frame and fixed to a cover plate fixing area disposed on the first surface of the frame, and a projection disposed on the proof-mass at the first surface side to prevent the proof-mass from sticking to the cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.