Method of manufacturing a semiconductor device having MEMS
US7482196B2 · kind B2 · utility
1Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Nov 17, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.