Electronic devices
US7482207B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/887
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming an electronic device in a multilayer structure comprising the steps of: defining a topographic profile in a laterally extending first layer; depositing at least one non-planarizing layer on top of the first layer such that the topographic profile of the surface of the or each non-planarizing layer conforms to that of the laterally extending first layer; and depositing a pattern of at least one additional layer onto the top-most non-planarizing layer, such that the lateral location of the additional layer is defined by the shape of the topographic profile of the non-planarizing layer, and whereby the additional layer is laterally aligned with the topographic profile in the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.