Processing a memory link with a set of at least two laser pulses
US7482551B2 · kind B2 · utility
5Cited by
177References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Nov 23, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.