Surface-mounted microwave package and corresponding mounting with a multilayer circuit
US7482678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10727
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a microwave package delimiting an interior volume, comprising a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.