High resolution statistical analysis of localized corrosion by direct measurement
US7483152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2005 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N17/006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The process involves first taking height measurements of a surface area at a relatively high resolution, such as 0.1 microns over a range of about 100 microns, of a particular surface area of a substrate prior to any corrosive effect on the substrate. This measurement or scan gives a first digital surface map. The substrate is then subjected to a corrosive environment. The same surface area is then measured with the same height resolution to give a second map, where the height of the surface area may be diminished or reduced in local areas or pits characteristic of localized corrosion. The two surface maps are subtracted to give a measurement of the extent of localized corrosion. The two surface maps may be subtracted electronically or digitally. This method may be accomplished over a relatively short time period, e.g. hours, as compared with conventional corrosion evaluation techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.