Cooling assembly comprising micro-jets
US7483770B2 · kind B2 · utility
15Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2004 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Nov 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling assembly for cooling a heat source, such an electronic components, with a coolant includes micro jets adapted to eject the coolant onto the heat source in response to a control signal, and a controller adapted to control the ejection of the coolant from the micro jets in a sweep mode in which the micro jets eject the coolant sequentially. The micro jets may be arranged as an array and the coolant is forced induce velocity perturbations of the coolant, to avoid the occurrence of free circulation areas in the cooling channel, and to obtain a microscopic transport of the cooling through the cooling channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.