Method of forming a conductive through hole for a piezoelectric substrate
US7484279B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Nov 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a method of forming a part of a through-hole for a piezoelectric substrate having an excitation electrode and a leading electrode which are formed on a first surface of the piezoelectric substrate and are made of a thin metal film in order to establish a conductivity, the method includes: blasting a position on a second surface of the piezoelectric substrate corresponding to the leading electrode to form a preliminary hole by boring the piezoelectric substrate in its halfway; etching a bottom of the preliminary hole to form a part of a through-hole through which a part of the leading electrode is exposed; and placing a conductive material in the part of a through-hole, the conductive material contacting the leading electrode from a side of the second surface of the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.