Mounting structure of pressure sensor element
US7484419B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Dec 13, 2026 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16H2059/683
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A pressure sensor can be mounted to an object with a pressure to be measured by a mounting structure. The mounting structure includes bonding a first member and a second member, a medium passageway formed on one of the bonding face thereof, a flexible printed wiring board interposed between both bonding faces through gaskets, and a pressure sensor element electrically connected to the flexible printed wiring board by an electrically conductive member so that the sensor element electrically connects to the outside of the object. The pressure sensor element is disposed in a recess that is formed on the bonding face. The presser medium is transferred through an introduction hole from the medium passageway to the pressure sensor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.