Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
US7485028B2 · kind B2 · utility
15Cited by
23References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2005 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Jun 30, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure is directed to a chemical mechanical polishing retaining ring including a polymer matrix and a filler including polyimide. The chemical mechanical polishing retaining ring has a wear rate performance not greater than about 75 microns/hour.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.