Dicing die adhesive film for semiconductor
US7485494B2 · kind B2 · utility
3Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Aug 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.