Structure for joining a semiconductor package to a substrate using a solder column
US7485959B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Jan 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. The insulating protective openings protect the solder column against stress faults to form reliable electrical connections and to support high-density electrical connections between the semiconductor package and the package mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.