Electronic component and manufacturing method thereof
US7486160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Feb 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic component excellent in moisture resistance capable of ensuring electrical connection between electrodes and hermeticity of a sealed region including a vibrating part and suppressing an increase in size. An electronic component including a piezoelectric element provided with a vibrating part and a first electrode on one face of a piezoelectric substrate and a printed circuit substrate having a second electrode is constituted by including: a bump provided in advance on one of the first electrode and the second electrode and connected to the other of the first electrode and the second electrode; an annular first metal layer surrounding the vibrating part; and a solder material with a solidus temperature lower than the bump, sealing a space between the first metal layer and the printed circuit substrate to make a placement region of the vibrating part a hermetic space, whereby moisture permeation into the hermetic space and the outward spread of the solder material can be suppressed, and a space for the bump to spread by being melted can be omitted. Moreover, the electrical connection between the electrodes and the sealing of the placement region can be …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.