Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass
US7486480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Apr 19, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.