System for cooling a heat-generating electronic device with increased air flow
US7486519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Apr 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a bottom side and coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes. One advantage of this design is that it enables a greater volume of air to flow through the fan assembly relative to prior art designs, thereby resulting in more efficient cooling of the heat-generating electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.