Techniques and devices for characterizing spatially non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects
US7487050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Jul 5, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/936
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location. Techniques and devices for determining a misfit strain between a film and a substrate on which the film is deposited are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.