Terminal electrode forming apparatus and system for holding electronic components
US7487815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2005 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Feb 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1906
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.