Metallic mold for optical element and optical element
US7488170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2005 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Feb 5, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/00413
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding die for forming an optical element, comprises a base body; a film layer formed on the base body and having a thickness of 0.01 to 500 μm; and a transferring surface formed on a surface of the film layer by a predetermined process and having a surface roughness Ra of 0.1 to 50 nm. The film layer is formed by an amorphous alloy having a supercooled liquid state containing 20 mol % or more of at least one atom of Pt, Ir, Au, Pd, Ru, Rh, Fe, Co, Ni, Zr, Al, Ti, Cu, W, Mo, Cr, B, and P and the transferring surface maintains the surface roughness after the transferring surface is heated to a temperature which is higher 50° C. higher than the glass transition temperature (Tg) of the optical element formed by the transferring surface and lower than the glass transition temperature of the amorphous alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.