Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections
US7488192B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2008 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Jan 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mounted apparatus for use with electrical component interconnections including a planar surface, a slide disposed proximate to the planar surface and being made of a material having a coefficient of thermal expansion (CTE) that is substantially matched to that of a material of the planar surface, the slide being further configured to accommodate solderable contact elements stitched therethrough and soldered to the planar surface, a connector body to support the slide in a cavity defined therein, the cavity being sufficiently large to allow the slide to float in accordance with thermal expansions and contractions of the slide and the planar surface, which respectively occur during solder reflow and subsequent cool-down of the connector assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.