Patent · US Active

Method for producing a surface-mountable semiconductor component

US7488622B2 · kind B2 · utility

2Cited by

9References

14Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Georg Bogner · Lappersdorf, DE
Jörg Erich Sorg · Regensburg, DE
Gunter Waitl · Regensburg, DE

Key dates

Filing date	Apr 2, 2007
Grant date	Feb 10, 2009
Priority date	—
Expiry date	Jul 23, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical connections, which are electrically conductively connected to at least two electrical contacts of the semiconductor chip, and an encapsulation material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.