Organic aluminum precursor and method of forming a metal wire using the same
US7488684B2 · kind B2 · utility
1Cited by
1References
8Claims
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Key dates
| Filing date | Sep 20, 2006 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Sep 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An organic aluminum precursor includes aluminum as a central metal, and borohydride and trimethylamine as ligands. In a method of forming an aluminum layer or wire, the organic aluminum presursor is introduced onto a substrate, and then thermally decomposed. The aluminum decomposed from the organic aluminum precursor is deposited on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.