Coiled circuit device and method of making the same
US7488994B2 · kind B2 · utility
1Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2004 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/01
Abstract
A coiled circuit device is produced by forming a circuit layer on a substrate. Optional insulator layers may be disposed above and below the circuit layer. The circuit layer, which may be memory, control, or other circuitry, is released from the substrate such that it coils into a dense, coiled device. A stressed coiling layer may be included which effects coiling when the circuit layer is released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.