Fixed parallel plate MEMS capacitor microsensor array
US7489017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2006 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Nov 6, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fixed parallel plate micro-mechanical systems (MEMS) based sensor is fabricated to allow a dissolved dielectric to flow through a porous top plate, coming to rest on a bottom plate. A post-deposition bake ensures further purity and uniformity of the dielectric layer. In one embodiment, the dielectric is a polymer. In one embodiment, a support layer is deposited onto the top plate for strengthening the sensor. In another embodiment, the bottom plate is dual-layered for a narrowed gap. Integrated circuit arrays of such sensors can be made, having multiple devices separated from each other by a physical barrier, such as a polycrystalline containment rim or trough, for preventing polymer material from one sensor from interfering with that of another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.