Heat dissipation device
US7489513B2 · kind B2 · utility
8Cited by
17References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.