Blister pack system
US7489594B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jan 23, 2003 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Sep 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0293
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A blister pack system has a printed board, and the outside of the film of the blister pack has individual contact spots each assigned to a respective bag. Individual strip conductors run from each contact spot to a common conductor strip via the respective bag on the outside of the film. When a dragée is removed from a bag, the strip conductor assigned to the bag is interrupted. The printed board has perforations corresponding to the pattern of the bags and contact spots corresponding to the pattern of the contact spots of the blister pack. The contact spots of the board are directed towards the contact spots of the pack while the perforations of the board are directed towards the bags of the board. An edge area of the printed board has connecting contact spots each connected to a contact spot of the printed board via an individual strip conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.