Multi-chip switch based on proximity communication
US7490189B2 · kind B2 · utility
25Cited by
20References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Apr 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L49/3027
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A switch contains a first semiconductor die, which is configured to receive signals on a plurality of input ports and to output the signals on a plurality of output ports. The first semiconductor die is further configured to selectively couple the signals between the input and output ports using a plurality of switching elements in accordance with a set of control signals, which correspond to a configuration of the switch. During this process, a plurality of proximity connectors, proximate to a surface of the semiconductor die, are configured to communicate the signals by capacitive coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.