Sensor attachment structure and ultrasonic sensing device
US7490517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2006 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Aug 23, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S7/521
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.