Drilling, perforating and formation analysis
US7490664B2 · kind B2 · utility
77Cited by
66References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Aug 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/718
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method of drilling and/or perforating uses a laser beam to remove material, such as to perforate the casing, cement and formation or drill a well bore. The system and method can further or alternately encompass material analysis that can be performed without removing the material from the well bore. The analysis can be performed apart from or in connection with drilling operations and/or perforating the casing, cement and formation. The analysis can be used in a feed back loop to adjust material removal, adjust material analysis, determine the location of future material removal, and for other uses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.